TSMC’s latest earnings guidance has significantly exceeded market expectations, drawing widespread attention. During its Q2 2024 earnings call, the company raised its full-year revenue growth forecast to 20%–25% (up from the previous range of 16%–21%) and substantially increased its capital expenditure plan to $30–32 billion, primarily to expand advanced node capacity (such as 3nm and 2nm) and AI-related production. This upbeat outlook is largely driven by surging global demand for high-performance computing (HPC) chips fueled by the artificial intelligence boom, with strong orders from major clients like NVIDIA, AMD, and Apple. Additionally, TSMC’s leadership in advanced packaging technologies—particularly CoWoS—has cemented its role as a critical player in the AI server supply chain. Management noted that AI-related revenue now accounts for nearly 30% of total sales and is poised for further growth. Analysts widely view TSMC’s stronger-than-expected guidance as a testament to its technological moat and manufacturing scale, signaling a potential upswing in the broader semiconductor industry cycle.
台积电（TSMC）最新发布的业绩指引全线超预期，引发市场广泛关注。在2024年第二季度财报电话会议上，公司不仅上调了全年营收增长预期至20%–25%（此前为16%–21%），还大幅提高了资本支出计划，预计全年将投入300亿至320亿美元，主要用于先进制程（如3nm、2nm）及AI相关产能扩张。这一积极信号主要受益于全球人工智能热潮带动的高性能计算（HPC）芯片需求激增，尤其是来自英伟达、AMD、苹果等大客户的强劲订单。此外，台积电在先进封装技术（如CoWoS）方面的领先地位，也使其成为AI服务器供应链中的关键一环。管理层强调，AI相关营收已占公司总营收近三成，并有望持续增长。市场普遍认为，台积电的超预期指引不仅反映其技术护城河和产能优势，也预示着半导体行业正进入新一轮上行周期。
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