Recently, multiple semiconductor experts emphasized at industry forums that for China’s domestic chip industry—’China Chips’—to achieve genuine self-reliance and control, it must conquer the critical stronghold of high-end devices. While China has made significant progress in mid-to-low-end chip manufacturing and packaging/testing, it remains heavily dependent on imported equipment and technology for advanced logic chips, memory chips, and cutting-edge process nodes (e.g., 7nm and below). Experts stress that high-end devices are not only essential for frontier technologies like smartphones, artificial intelligence, and high-performance computing but also serve as strategic cornerstones for national information security and supply chain resilience. Without breakthroughs in bottleneck areas such as photolithography machines, EDA tools, and advanced materials, China’s semiconductor sector will struggle to break free from external constraints. Therefore, experts urge increased investment in fundamental research, stronger collaboration among academia, industry, and research institutions, accelerated core technology development, and the establishment of a fully self-reliant industrial ecosystem. Only by mastering end-to-end capabilities in high-end chip production can China gain strategic initiative in the global semiconductor landscape and transition from ‘catching up’ to ‘keeping pace’—and eventually ‘leading the race.’
近期，多位半导体领域专家在行业论坛上强调：‘中国芯’要实现真正自主可控，必须攻克高端器件这一关键堡垒。当前，尽管中国在中低端芯片制造和封装测试环节已取得显著进展，但在高端逻辑芯片、存储芯片以及先进制程工艺（如7纳米及以下）方面，仍严重依赖进口设备与技术。专家指出，高端器件不仅是智能手机、人工智能、高性能计算等前沿科技的核心支撑，更是国家信息安全与产业链安全的战略基石。若无法突破光刻机、EDA工具、高端材料等‘卡脖子’环节，中国半导体产业将难以摆脱外部制约。为此，专家呼吁加大基础研究投入，强化产学研协同，加速核心技术攻关，并构建自主可控的产业生态体系。唯有掌握高端芯片的全链条能力，中国才能在全球半导体竞争格局中占据主动，真正实现从‘跟跑’到‘并跑’乃至‘领跑’的跨越。
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