Recently, China Securities Co., Ltd. (CSC) released a research report indicating that global memory chip prices have been steadily rising since the second half of 2023, and this upward trend has now propagated from upstream wafer fabrication and packaging/testing stages all the way to end-consumer markets. The report attributes this price surge primarily to surging demand for AI servers, inventory restocking in consumer electronics such as smartphones and PCs, and improved supply-demand dynamics resulting from deliberate production cuts by major memory manufacturers. Notably, DRAM and NAND Flash—the two dominant memory products—have seen significant price increases, with some models rising over 30%.Importantly, these price hikes are no longer confined to B2B transactions but are now influencing everyday consumers’ purchasing decisions. For instance, newly launched high-end smartphones, laptops, and solid-state drives (SSDs) have seen widespread price adjustments upward, and some brands have even delayed product launches due to cost pressures. CSC forecasts that as AI applications become more pervasive and data center construction accelerates, memory chip prices will likely remain elevated throughout 2024, offering little near-term relief for consumers.The report advises investors to focus on memory supply chain companies with strong vertical integration or close partnerships with major clients, while suggesting consumers consider timing their device upgrades or storage purchases around promotional periods to mitigate costs.
近期，中信建投证券发布研究报告指出，全球存储芯片价格自2023年下半年以来持续上涨，且这一轮涨价趋势已从上游晶圆制造和封测环节逐步传导至消费终端市场。报告分析认为，主要驱动因素包括AI服务器需求激增、智能手机和PC等消费电子库存回补、以及原厂主动减产带来的供需格局改善。尤其在DRAM和NAND Flash两大主流存储产品中，价格涨幅显著，部分型号涨幅超过30%。值得注意的是，这种价格上涨已不再局限于B2B领域，而是开始影响到普通消费者的购买决策。例如，新发布的高端手机、笔记本电脑及固态硬盘（SSD）等产品的售价普遍上调，部分品牌甚至因成本压力推迟了新品上市节奏。中信建投预计，随着AI应用的进一步普及和数据中心建设加速，存储芯片价格在2024年仍将维持高位震荡，消费端价格压力短期内难以缓解。该报告提醒投资者关注具备垂直整合能力或与大客户绑定紧密的存储产业链企业，同时建议消费者在换机或升级存储设备时，可适当关注促销节点以降低采购成本。
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