Recently, TSMC disclosed that the gross margin of its Arizona fab in the United States has shrunk by nearly 87% compared to its plants in Taiwan, drawing significant industry attention. Key reasons include substantially higher construction and operational costs in the U.S., an underdeveloped local supply chain, relatively lower labor productivity, and the high fixed-cost burden during the initial ramp-up phase. Although the U.S. government offers subsidies through the CHIPS and Science Act, these incentives are insufficient to fully offset the current operational disadvantages in the short term. TSMC executives have acknowledged that the U.S. facility is unlikely to match the profitability of its Taiwan counterparts in the foreseeable future. Nevertheless, the company remains committed to its overseas expansion due to geopolitical considerations and the strategic need to diversify its customer base. This situation highlights the high costs associated with efforts to decentralize global semiconductor supply chains and underscores the structural challenges of relocating advanced chip manufacturing abroad.
近期，台积电（TSMC）披露其美国亚利桑那州晶圆厂的毛利率大幅缩水，较台湾本土工厂下降近87%。这一数据引发业界广泛关注。造成这一现象的主要原因包括：美国建厂成本高昂、供应链配套尚不完善、劳动力效率相对较低，以及初期产能爬坡阶段的固定成本分摊压力。此外，美国政府虽提供《芯片与科学法案》补贴，但短期内难以完全抵消运营劣势。台积电高层坦言，美国厂在可预见的未来难以达到台湾厂区的盈利水平，但出于地缘政治与客户多元化战略考量，仍将持续推进海外布局。此事件也凸显了全球半导体产业链“去集中化”背后的高成本现实，以及先进制程制造向海外转移所面临的结构性挑战。
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