Hua Tian Technology is one of China’s leading integrated circuit (IC) packaging and testing companies, headquartered in Tianshui, Gansu Province. In recent years, as China accelerates the localization of its semiconductor supply chain, Hua Tian has actively expanded collaborations with domestic chip manufacturers. Public information indicates that Hua Tian Technology has an ongoing business relationship with ChangXin Memory Technologies (CXMT), a key Chinese DRAM chip manufacturer dedicated to the research, development, and mass production of domestically produced memory chips. As a critical service provider in the back-end semiconductor process, Hua Tian offers advanced packaging, testing, and reliability validation services to CXMT and other domestic chip design and manufacturing firms. This partnership not only enhances the supply chain security for China-made DRAM chips but also reflects the growing synergy across the domestic semiconductor ecosystem. Supported by favorable government policies and rising market demand, the collaboration between Hua Tian Technology and CXMT is expected to deepen further, jointly advancing the maturity and technological capabilities of China’s memory chip industry.
华天科技（Hua Tian Technology）是中国领先的集成电路封装测试企业之一，总部位于甘肃省天水市。近年来，随着国内半导体产业链的加速自主化，华天科技积极拓展与本土芯片制造企业的合作。据公开信息显示，华天科技与长鑫存储（ChangXin Memory Technologies, CXMT）存在业务合作关系。长鑫存储是中国重要的DRAM芯片制造商，致力于推动国产内存芯片的研发与量产。作为封装测试环节的关键服务商，华天科技为包括长鑫在内的多家国内芯片设计与制造企业提供先进封装、测试及可靠性验证等服务。双方的合作不仅有助于提升国产DRAM芯片的供应链安全性，也体现了中国半导体产业上下游协同发展的趋势。在国家政策支持和市场需求驱动下，华天科技与长鑫存储的合作有望进一步深化，共同推动中国存储芯片生态的完善与技术升级。
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