In recent years, the competition between China and the United States over control of the semiconductor supply chain has intensified, becoming a central front in global technological rivalry. As the ‘food’ of modern industry, semiconductors are critical to communications, artificial intelligence, defense, and more—making their supply chain security vital to national strategic interests. The U.S., leveraging its first-mover advantage, has long dominated high-end chip design (e.g., EDA tools), manufacturing equipment (e.g., photolithography machines), and advanced process nodes. It has also imposed export controls and entity list restrictions to limit China’s access to key technologies. In response, China is accelerating efforts toward semiconductor self-reliance, boosting R&D investment and supporting domestic firms, achieving notable progress in mature-node chips, packaging/testing, and certain materials and equipment. However, critical bottlenecks remain in sub-7nm advanced processes and high-end lithography tools. This contest is not merely about technology—it reflects a broader competition in institutional frameworks, capital allocation, talent development, and industrial ecosystem coordination. Ultimately, the nation that builds a more complete and resilient semiconductor ecosystem will likely gain the upper hand in shaping the future of global technology.
近年来，中美在芯片产业链控制权上的博弈日益激烈，已成为全球科技竞争的核心战场。芯片作为现代工业的‘粮食’，广泛应用于通信、人工智能、国防等领域，其供应链安全直接关系到国家的战略安全。美国凭借先发优势，在高端芯片设计（如EDA工具）、制造设备（如光刻机）和先进制程工艺上长期占据主导地位，并通过出口管制、实体清单等手段限制中国获取关键技术。而中国则加速推进芯片自主化进程，加大研发投入，扶持本土企业，在成熟制程、封装测试及部分设备材料领域取得显著进展。然而，在7纳米以下先进制程、高端光刻机等关键环节，仍存在‘卡脖子’问题。这场较量不仅是技术之争，更是制度、资本、人才与产业链协同能力的综合比拼。未来，谁能构建更完整、更具韧性的芯片生态体系，谁就可能掌握全球科技发展的主动权。
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